By Duixian Liu; et al
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Extra info for Advanced millimeter-wave technologies : antennas, packaging and circuits
The ground therefore follows along the wirebond and removes the effect of the often unknown ground return path of a package. 2 Glass Microwave Integrated Circuit (GMIC, HMIC) – TYCO, M/A-COM A heterolithic microwave integrated circuit (HMIC) uses silicon pedestal embedded in a glass substrate. Conductors can be deposited on top of the glass to form transmission lines or lumped elements, such as spiral inductors, baluns or MIM capacitors. The silicon pedestals may act as conductive vias from the top to the bottom of the die, or there may be diodes formed at the tops of the pedestals.
A hybrid circuit technology is used to mount semiconductor components as bare die on a thin-film substrate. The process features bare die wire or ribbon bonding, beam lead, flipchip, or surface mount device (SMD) mounting. The process supports 4 µm gold conductors, laser trimmable NiCr thin-film resistors, SiN thin-film capacitors, air bridges, and via holes. 27 mm). 9). Transmission lines are realized as microstrip, co-planar waveguide (CPW), or slotline. g. 20 or more. Individual substrates are clamped into the package, which simplifies the assembly and disassembly process.
The answer is highly dependent on the required complexity, performance, market volumes and business plans. Depending on whom one is talking to, the answer may be that the packaging cost has to be low enough to open up emerging markets and to maximize profit margins. The real cost challenge arises, however, if the package cost cannot follow the die cost reduction. 7 illustrates the general cost versus volume trade-off that is typically assumed for silicon chips. A packaging technology may end up being a technology barrier if it cannot follow this silicon die cost trend.